The Dynasolve 200 Series solvents are reactive formulated solvents which are used to remove cured silicones in both electronic and industrial applications. The four products vary based on aggression level and flash point, so the best product for a given application depends on the desired balance of aggression and flash point (see comparison below).
Depotting and decapsulating electronic components, Conformal coating removal, Industrial silicone removal and cleaning
Dynasolve 200 Series are compatible with the following materials: All metals, Teflon®, and Polyethylene & Polypropylene. Avoid the following materials: Nylon, PVC, and Do not immerse in aluminium for more than 8 hours.
Dynasolve 200 Series removes the following materials: Conformal coatings, Encapsulants/potting compounds, RTVs, and Industrial silicones
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