The Dynasolve 700 series solvents are reactive formulated solvents which are used to remove anhydride-cured epoxy, urethane, and silicone. The solvents are used in both industrial and electronic applications. The four products differ in terms of aluminium compatibility, the presence or not of the solvent NMP, and REACH compliance (see comparison below).
Depoting and decapsulating electronic components, Industrial polymer removal and cleaning
Dynasolve 700 Series are compatible with the following materials: Most metals, Teflon®, Polyethylene & Polypropylene, and Neoprene. Avoid the following materials: Galvanized steel & Titanium, Liquid Isocyanate, Vinyl, Lucite®, and Plexiglas & Polystyrene.
Dynasolve 700 Series removes the following materials: Anhydride⬐cured epoxy, Urethane, and Silicone.
We only ask for your email address before you can download; with the other data we can serve you even better.
Your details will be handled carefully in accordance with our Privacy Statement and will be used to process your requests.This information is also automatically removed from our internet management system, if no further actions follow.